Board Revision History

Rev A

  • Date of first manufacture: 2015-06-10
  • First board release
  • RJ45 part Amphenol RJE72-488-1401 (no LEDs)
  • Uses dual color LEDs Avago HSMF-C157
  • 4-layer PCB design

Rev B

  • Date of first manufacture: 2016-02-12
  • Changed 125MHz oscillator to Micrel MEMS part DSC1121DI2-125.0000T to replace obsolete On Semi part NBXDPA019LNHTAG (device with CMOS outputs and 2.5mm x 2.0mm package)
  • Removed FSEL option - consequence of the oscillator part change
  • Added buffer to CLK_EN input to allow it to be driven at 1.8V
  • Removed the solder jumpers for FSEL and CLK_EN
  • RJ45 part changed to Amphenol RJE72-488-1451 (with LEDs)
  • Removed Avago HSMF-C157 dual color LEDs

This revision was never released due to procurement difficulty of the Micrel MEMS part. It was mistakenly designed for CMOS device DSC1121DI2-125.0000T which was available at the time, however in order to satisfy the VITA 57.1 standard the device used should have had LVDS outputs. The Micrel part variant with LVDS outputs was not procurable in the same package at that time, so we did not release Rev-B and we incorporated the package and device change in Rev-C.

Rev C

  • Date of first manufacture: 2016-05-05
  • Changed 125MHz oscillator to Micrel MEMS part DSC1123CI2-125.0000 (device with LVDS outputs and 3.2mm x 2.5mm package)

Rev D

  • Date of first manufacture: 2017-06-22
  • Redesigned PCB to 8-layers to internalize RGMII traces in an effort to reduce radiated emissions

Rev E

  • Date of first manufacture: 2020-08-25
  • PHY thermal vias now via-in-pad
  • Changed R24 and R25 to 240R 0402 from 0603
  • Added CE logo to silkscreen
← RGMII Interface Timing Considerations
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